Research on reliability of straight pin solder joints in CFP package with different process parameters

To examine the effects of various process parameters on the reliability of straight pin solder joints in CFP packaging, assemblies were fabricated with randomly combined process conditions. Analysis of solder joint performance under temperature cycling indicates that device type and pin length exert the most significant influence on CFP packaging reliability. Specifically, the CFP08 package demonstrates the highest thermal fatigue resistance. Moreover, longer pin lengths are associated with improved thermal fatigue performance of the solder joints. Complementary simulations and experimental validation were conducted to compare the reliability of assemblies with different pin configurations. The findings reveal tha t increasing the stress relief space substantially enhances solder joint reliability.