Thickness‐Driven Modulation of Electronic Transport in SnSe <sub>2</sub> ‐grown Films by Low‐Temperature Atomic Layer Deposition

ABSTRACT Low‐temperature atomic layer deposition (ALD) is increasingly important for the integration of layered metal dichalcogenides such as tin diselenide (SnSe 2 ) into advanced nanoelectronic devices, where compatibility with temperature‐sensitive substrates and precise thickness control are essential. Using a novel and highly reactive selenium precursor, namely, bis(trimethylstannyl)selenide or Se(SnMe 3 ) 2 , SnSe 2 films are deposited at reduced temperatures. As‐deposited films are initially amorphous, however, post‐deposition annealing at 250°C induces crystallization. Structural analysis reveals a clear evolution in crystallinity: ultrathin films (∼25 nm) exhibit nearly single‐crystalline, defect‐free domains, while thicker films (∼100 nm) transition to a polycrystalline structure. This controlled variation in crystal quality directly influences the electronic transport properties, demonstrating the potential of low‐temperature ALD combined with mild annealing for scalable fabrication of high‐performance, thickness‐engineered SnSe 2 ‐based devices.

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Publication Details

Journal
Advanced Electronic Materials
Published
2025-12-17
DOI
https://doi.org/10.1002/aelm.202500560
Primary Topic
2D Materials and Applications
Type
article
Field-Weighted Citation Impact
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article

Thickness‐Driven Modulation of Electronic Transport in SnSe 2 ‐grown Films by Low‐Temperature Atomic Layer Deposition

Jaakko Julin, E. Blanco, Filip Bureš, J. Outón et al.
Advanced Electronic Materials
2D Materials and Applications
article

Thickness‐Driven Modulation of Electronic Transport in SnSe 2 ‐grown Films by Low‐Temperature Atomic Layer Deposition

Jaakko Julin, E. Blanco, Filip Bureš, J. Outón, Ralf Tonner, Jaroslav Charvot, Sebastian Lehmann, Daniel Wolf, Amin Bahrami, Lars Giebeler, Angelika Wrzesińska, Alejandra Ruiz‐Clavijo, Fabian Pieck, Yana Vaynzof, Kornelius Nielsch
article en

Abstract

ABSTRACT Low‐temperature atomic layer deposition (ALD) is increasingly important for the integration of layered metal dichalcogenides such as tin diselenide (SnSe 2 ) into advanced nanoelectronic devices, where compatibility with temperature‐sensitive substrates and precise thickness control are essential. Using a novel and highly reactive selenium precursor, namely, bis(trimethylstannyl)selenide or Se(SnMe 3 ) 2 , SnSe 2 films are deposited at reduced temperatures. As‐deposited films are initially amorphous, however, post‐deposition annealing at 250°C induces crystallization. Structural analysis reveals a clear evolution in crystallinity: ultrathin films (∼25 nm) exhibit nearly single‐crystalline, defect‐free domains, while thicker films (∼100 nm) transition to a polycrystalline structure. This controlled variation in crystal quality directly influences the electronic transport properties, demonstrating the potential of low‐temperature ALD combined with mild annealing for scalable fabrication of high‐performance, thickness‐engineered SnSe 2 ‐based devices.

Advanced Electronic MaterialsVol. 12(2)
University of Pardubice (CZ), Leibniz Institute for Solid State and Materials Research (DE), Universidad de Cádiz (ES), Technische Universität Dresden (DE), Leipzig University (DE), University of Jyväskylä (FI)
Deutsche Forschungsgemeinschaft, Universität Leipzig
Openalex Percentile: Top 66%
2D Materials and Applications
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