TiO2 nanowires growth mechanism via thermal oxidation assisted by Au nanoparticles

• A growth mechanism for nanowires produced by seed-assisted oxidation is presented. • The Ti interstitials migrate from the metallic Ti substrate through the TiO 2 layer to the Au nanoparticle on the surface. • Nanometric heterojunction at the Au nanoparticle/TiO 2 interface improves the growth rate locally. • The Ti underlayer acts as a source of Ti interstitials while a thick TiO 2 layer inhibits the nanowires' growth. Nanowires (Nws) play a crucial role in titanium dioxide's photo-physical and photochemical applications, such as photovoltaics, photocatalysis, and water splitting. Among the techniques employed to synthesise nanostructures, the Au seed-assisted thermal oxidation is the simplest and the most intriguing. TiO 2 NWs, with Au-nanoparticles (AuNPs) on the tip, can be obtained by annealing in air, a thin Au film deposited on a metallic Ti. Au-NPs, formed during the annealing, act as seeds for NWs growth, while the oxide layer, formed during oxidation, inhibits the Nws growth. An in-depth investigation is conducted on the effects of various substrates, oxide layer thickness, and oxidation time. We propose a diffusion mechanism involving the transport of Ti interstitials from the metallic Ti substrate, through the TiO 2 , to the surface. Moreover, high-resolution conductive AFM analysis at the AuNp/TiO 2 interface suggests the formation of a nanometric heterojunction. The heterojunction electric field promotes a localised enrichment of Ti interstitials close to AuNps, thereby enhancing the oxidation rate and resulting in the creation of TiO 2 nanowires.

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Publication Details

Journal
Surfaces and Interfaces
Published
2025-12-17
DOI
https://doi.org/10.1016/j.surfin.2025.108340
Primary Topic
Nanomaterials and Printing Technologies
Type
article
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article

TiO2 nanowires growth mechanism via thermal oxidation assisted by Au nanoparticles

Cristiano Lo Pò, Francesco Ruffino, G. Impellizzeri, Massimo Zimbone et al.
Surfaces and Interfaces
Nanomaterials and Printing Technologies
article

TiO2 nanowires growth mechanism via thermal oxidation assisted by Au nanoparticles

Cristiano Lo Pò, Francesco Ruffino, G. Impellizzeri, Massimo Zimbone, Antonella Sciuto, L. Calcagno
article en

Abstract

• A growth mechanism for nanowires produced by seed-assisted oxidation is presented. • The Ti interstitials migrate from the metallic Ti substrate through the TiO 2 layer to the Au nanoparticle on the surface. • Nanometric heterojunction at the Au nanoparticle/TiO 2 interface improves the growth rate locally. • The Ti underlayer acts as a source of Ti interstitials while a thick TiO 2 layer inhibits the nanowires' growth. Nanowires (Nws) play a crucial role in titanium dioxide's photo-physical and photochemical applications, such as photovoltaics, photocatalysis, and water splitting. Among the techniques employed to synthesise nanostructures, the Au seed-assisted thermal oxidation is the simplest and the most intriguing. TiO 2 NWs, with Au-nanoparticles (AuNPs) on the tip, can be obtained by annealing in air, a thin Au film deposited on a metallic Ti. Au-NPs, formed during the annealing, act as seeds for NWs growth, while the oxide layer, formed during oxidation, inhibits the Nws growth. An in-depth investigation is conducted on the effects of various substrates, oxide layer thickness, and oxidation time. We propose a diffusion mechanism involving the transport of Ti interstitials from the metallic Ti substrate, through the TiO 2 , to the surface. Moreover, high-resolution conductive AFM analysis at the AuNp/TiO 2 interface suggests the formation of a nanometric heterojunction. The heterojunction electric field promotes a localised enrichment of Ti interstitials close to AuNps, thereby enhancing the oxidation rate and resulting in the creation of TiO 2 nanowires.

Surfaces and InterfacesVol. 80
University of Catania (IT), Osservatorio Astrofisico di Catania (IT), Institute for Microelectronics and Microsystems (IT)
Openalex Percentile: Top 59%
Nanomaterials and Printing Technologies
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