Cu Filling into Seed and Seedless Layered Through-Silicon-Via and Hybrid Bonding for High-Density Semiconductor Packaging

Authors

Jae Pil Jung (ORCID: https://orcid.org/0000-0002-4526-0442)
Chae Yeon Lim (ORCID: https://orcid.org/0000-0002-8592-1153)
Hyun‐Sik Kim (ORCID: https://orcid.org/0000-0001-8934-4042)
Shin Hui Seon

Institutions

University of Seoul (KR)

Publication Details

Journal: Korean Journal of Materials Research
Published: 2025-11-27
DOI: https://doi.org/10.3740/mrsk.2025.35.11.511
Primary Topic: 3D IC and TSV technologies
Type: article
Field-Weighted Citation Impact: 0.00

Funders

Ministry of Trade, Industry and Energy
Korea Evaluation Institute of Industrial Technology

Controls

|||

ALL TIME

JAN

FEB

MAR

APR

MAY

JUN

JUL

AUG

SEP

OCT

article

Cu Filling into Seed and Seedless Layered Through-Silicon-Via and Hybrid Bonding for High-Density Semiconductor Packaging

Jae Pil Jung, Chae Yeon Lim, Hyun‐Sik Kim, Shin Hui Seon

Nov 27, 2025

Korean Journal of Materials Research

3D IC and TSV technologies

article

Cu Filling into Seed and Seedless Layered Through-Silicon-Via and Hybrid Bonding for High-Density Semiconductor Packaging

Jae Pil Jung, Chae Yeon Lim, Hyun‐Sik Kim, Shin Hui Seon

November 27, 2025article en

Abstract

No abstract available for this paper.

Korean Journal of Materials ResearchVol. 35(11)

University of Seoul (KR)

Ministry of Trade, Industry and Energy, Korea Evaluation Institute of Industrial Technology

Openalex Percentile: Top 59%

3D IC and TSV technologies

DOI Open Access PDF OpenAlex

AI Navigator

Ask Laika to Summarize, Analyze, and Connect papers live on the map.

Summarize Papers & Methodologies

Extract key findings, datasets, and comparative methods across publications.

Benchmark Rankings & Visual Analytics

Rank top research institutions, authors, funders, topics, and journals by Field-Weighted Citation Impact (FWCI) and paper volume with instant charts.

Connect Distant Disciplines

Bridge topological clusters on the map to find hidden collaborative intersections.

Cu Filling into Seed and Seedless Layered Through-Silicon-Via and Hybrid Bonding for High-Density Semiconductor Packaging — Jae Pil Jung, Chae Yeon Lim, et al. · Korean Journal of Materials Research (2025) | TGRS Research Map | TGRS