Solution‐Processable Protection: A Single‐Step Zn‐Doped Electrodeposition Strategy for Enhanced Cu Corrosion Resistance

ABSTRACT Cu is widely employed in interconnect devices but is vulnerable to corrosion in harsh environments. Traditional corrosion resistance methods, such as painting, chemical plating, cathodic protection, and alloying, are often costly or complex. In this work, a promising alternative method was investigated to enhance the chemical stability and corrosion resistance. The composition of electroplating solution was modified with zinc to form a protective carbonate film on the surface. The corrosion current density reduced from 1.01 × 10 −4 to 6.45 × 10 −5 A/cm 2 with 3 wt% zinc incorporated into CuSO 4 solution. Besides, the stability of Cu 2 O peaks under atmospheric exposure was maintained. XRD analysis shown the Cu (111) crystal orientation was favored with grain regrowth promoted. These advancements demonstrate the potential of this simpler, cost‐effective approach to improve the corrosion resistance of Cu coatings without compromising material properties.