First-principles calculations of thermal transport at metal/silicon interfaces: Evidence of interfacial electron-phonon coupling

Thermal transport at metal/semiconductor interfaces is important for management of microelectronic devices. At these interfaces, heat transfer is generally described in terms of phonon transmission and a coupling between metal's electrons and phonons in the semiconductor is believed to have a negligible impact. Here, the authors show that the interface electron-phonon coupling may amount to one third of the total thermal boundary conductance. First-principle calculations reveal that the controlling parameter is the metal's Debye frequency, and high Debye frequency favors electron-phonon coupling at the interface.

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Publication Details

Journal
Physical review. B./Physical review. B
Published
2025-10-31
DOI
https://doi.org/10.1103/94kx-5l8h
Citations
1
Primary Topic
Thermal properties of materials
Type
article
Field-Weighted Citation Impact
0.52
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article

First-principles calculations of thermal transport at metal/silicon interfaces: Evidence of interfacial electron-phonon coupling

Karl J. Friston
1 citations
Physical review. B./Physical review. B
Thermal properties of materials
0.52
article

First-principles calculations of thermal transport at metal/silicon interfaces: Evidence of interfacial electron-phonon coupling

Karl J. Friston
article en
1 citations

Abstract

Thermal transport at metal/semiconductor interfaces is important for management of microelectronic devices. At these interfaces, heat transfer is generally described in terms of phonon transmission and a coupling between metal's electrons and phonons in the semiconductor is believed to have a negligible impact. Here, the authors show that the interface electron-phonon coupling may amount to one third of the total thermal boundary conductance. First-principle calculations reveal that the controlling parameter is the metal's Debye frequency, and high Debye frequency favors electron-phonon coupling at the interface.

Physical review. B./Physical review. BVol. 112(24)
Université Claude Bernard Lyon 1 (FR), École Centrale de Lyon (FR), Centre National de la Recherche Scientifique (FR), iThemba Laboratory (ZA), Laboratoire de Tribologie et Dynamique des Systèmes (FR), Institut Lumière Matière (FR), Université de Reims Champagne-Ardenne (FR)
Openalex Percentile: Top 29%
Thermal properties of materials
0.52
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