大口径超薄单晶硅红外窗口多工序控形控性抛光(特邀)
Authors
- 王斌 WANG Bin
- 武兆平 WU Zhaoping
- 李金鹏 LI Jinpeng
- 董云芬 DONG Yunfen
- 李启宇 LI Qiyu
- 陆文剑 LU Wenjian
Publication Details
- Journal
- Infrared and Laser Engineering
- Published
- 2025-01-01
- DOI
- https://doi.org/10.3788/irla20250264
- Primary Topic
- Advanced Surface Polishing Techniques
- Type
- article
- Field-Weighted Citation Impact
- 0.00