Robust Full‐Surface Bonding of Substrate and Electrode for Ultra‐Flexible Sensor Integration (Adv. Mater. 49/2025)
Flexible Integration Method for Flexible Electronics In their Research Article (DOI: 10.1002/adma.202417590), Kenjiro Fukuda, Takao Someya, Tomoyuki Yokota, and co-workers present a novel hybrid direct bonding method that enables both gold and parylene bonding without adhesives. This technique enables the connection of wiring and devices without increasing thickness, thereby providing high flexibility, mechanical robustness, and electrical conductivity required for integrated, flexible devices. Leveraging this method for flexible electronics integration promises the development of flexible stacked devices.
Authors
- Takao Someya (ORCID: https://orcid.org/0000-0003-3051-1138)
- Daisuke Hashizume (ORCID: https://orcid.org/0000-0001-7152-4408)
- Toshihiro Itoh (ORCID: https://orcid.org/0000-0001-9679-085X)
- Shinjiro Umezu (ORCID: https://orcid.org/0000-0003-2146-5344)
- Michitaka Yamamoto (ORCID: https://orcid.org/0000-0001-6542-2800)
- Daishi Inoue
- Tomoyuki Yokota (ORCID: https://orcid.org/0000-0003-1546-8864)
- Masahito Takakuwa
- Kenjiro Fukuda (ORCID: https://orcid.org/0000-0001-8015-5819)
- Lulu Sun (ORCID: https://orcid.org/0000-0002-3586-0815)
Institutions
- Waseda University (JP)
- RIKEN (JP)
- RIKEN Center for Emergent Matter Science (JP)
- The University of Tokyo (JP)
Publication Details
- Journal
- Advanced Materials
- Published
- 2025-12-01
- DOI
- https://doi.org/10.1002/adma.71335
- Primary Topic
- Advanced Sensor and Energy Harvesting Materials
- Type
- article
- Field-Weighted Citation Impact
- 0.00