Probing the ideal limit of interfacial thermal conductance in two-dimensional van der Waals heterostructures
Abstract Probing the ideal limit of interfacial thermal conductance (ITC) in two-dimensional (2D) heterointerfaces is of paramount importance for assessing heat dissipation in 2D-based nanoelectronics. Using graphene/hexagonal boron nitride (Gr/ h -BN), a structurally isomorphous heterostructure with minimal mass contrast, as a prototype, we develop an accurate yet highly efficient machine-learned potential (MLP) model, which drives nonequilibrium molecular dynamics (NEMD) simulations on a realistically large system with over 300,000 atoms, enabling us to report the ideal limit range of ITC for 2D heterostructures at room temperature. We further unveil an intriguing stacking-sequence-dependent ITC hierarchy in the Gr/ h -BN heterostructure, which can be connected to moiré patterns and is likely universal in van der Waals layered materials. The underlying atomic-level mechanisms can be succinctly summarized as energy-favorable stacking sequences facilitating out-of-plane phonon energy transmission. This work demonstrates that MLP-driven MD simulations can serve as a new paradigm for probing and understanding thermal transport mechanisms in 2D heterostructures and other layered materials.
Authors
- Meng Han (ORCID: https://orcid.org/0000-0003-4763-5559)
- Xinyu Wu (ORCID: https://orcid.org/0000-0002-1117-5098)
- Yimin Yao (ORCID: https://orcid.org/0000-0002-6567-1396)
- Zheyong Fan (ORCID: https://orcid.org/0000-0002-2253-8210)
- Zhenqiang Ye (ORCID: https://orcid.org/0000-0001-9672-9493)
- Ting Liang (ORCID: https://orcid.org/0000-0002-3116-365X)
- Jianbin Xu (ORCID: https://orcid.org/0000-0003-0509-9508)
- Wengen Ouyang (ORCID: https://orcid.org/0000-0001-8700-1978)
- Xiaoliang Zeng (ORCID: https://orcid.org/0000-0002-1389-8484)
- Ke Wei Xu (ORCID: https://orcid.org/0000-0001-5254-5297)
- Penghua Ying (ORCID: https://orcid.org/0000-0002-5758-2369)
- Wenwu Jiang
Institutions
- Tel Aviv University (IL)
- Chinese University of Hong Kong (HK)
- Shenzhen University (CN)
- Chinese Academy of Sciences (CN)
- Wuhan University (CN)
- Shenzhen Institutes of Advanced Technology (CN)
- The University of Tokyo (JP)
- Bohai University (CN)
Publication Details
- Journal
- npj Computational Materials
- Published
- 2025-12-09
- DOI
- https://doi.org/10.1038/s41524-025-01885-y
- Citations
- 3
- Primary Topic
- Thermal properties of materials
- Type
- article
- Field-Weighted Citation Impact
- 1.55