Overlapping Nanostacks Enable Direct Printing of Organic LEDs

ABSTRACT A custom‐built laser‐induced forward transfer (LIFT) setup was developed to fabricate multimaterial organic light emitting diode (OLED) stacks under ambient laboratory conditions without the use of a cleanroom or encapsulation. The process enables precise control of layer thickness through parameter tuning as confirmed by vertical scanning interferometry (VSI), yielding smooth and homogeneous layers with surface roughness values down to . The process achieves tunable thicknesses between 19 nm and 45 nm, while the lateral resolution is limited to about . A three‐layer OLED stack (total thickness ) was printed and structurally characterized using focused ion beam scanning electron microscopy (FIB‐SEM) and time‐of‐flight secondary ion mass spectrometry (ToF‐SIMS), revealing distinct, well‐defined layer boundaries. First functional tests demonstrated electroluminescence at with an operational lifetime of at least . Despite the lack of encapsulation, the OLEDs remained stable under ambient conditions with a shelf life of up to days. These results confirm the potential of LIFT as a scalable and precise tool for the additive manufacturing of flexible thin‐film devices such as OLEDs, solar cells and fuel cells.

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Publication Details

Journal
Advanced Materials Interfaces
Published
2025-12-01
DOI
https://doi.org/10.1002/admi.202500501
Primary Topic
Nanofabrication and Lithography Techniques
Type
article
Field-Weighted Citation Impact
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article

Overlapping Nanostacks Enable Direct Printing of Organic LEDs

Yolita M. Eggeler, Erich Müller, Michael D. Kraft, Daniela S. Mattes et al.
Advanced Materials Interfaces
Nanofabrication and Lithography Techniques
article

Overlapping Nanostacks Enable Direct Printing of Organic LEDs

Yolita M. Eggeler, Erich Müller, Michael D. Kraft, Daniela S. Mattes, Mareen Stahlberger, Nadezda Kuznetsova, Dario Mager, Ulrich Gengenbach, Momina Amir, Alexander Welle, Jan Gerrit Korvink, Klaus‐Martin Reichert, Martina Plank, Stefan Lux, Laura Weber, Liane Koker, Frank Breitling, Maria Atalaia Rosa, Benjamin Weber, Jannik Schlindwein
article en

Abstract

ABSTRACT A custom‐built laser‐induced forward transfer (LIFT) setup was developed to fabricate multimaterial organic light emitting diode (OLED) stacks under ambient laboratory conditions without the use of a cleanroom or encapsulation. The process enables precise control of layer thickness through parameter tuning as confirmed by vertical scanning interferometry (VSI), yielding smooth and homogeneous layers with surface roughness values down to . The process achieves tunable thicknesses between 19 nm and 45 nm, while the lateral resolution is limited to about . A three‐layer OLED stack (total thickness ) was printed and structurally characterized using focused ion beam scanning electron microscopy (FIB‐SEM) and time‐of‐flight secondary ion mass spectrometry (ToF‐SIMS), revealing distinct, well‐defined layer boundaries. First functional tests demonstrated electroluminescence at with an operational lifetime of at least . Despite the lack of encapsulation, the OLEDs remained stable under ambient conditions with a shelf life of up to days. These results confirm the potential of LIFT as a scalable and precise tool for the additive manufacturing of flexible thin‐film devices such as OLEDs, solar cells and fuel cells.

Advanced Materials InterfacesVol. 12(24)
Karlsruhe Institute of Technology (DE), Kerntechnische Entsorgung Karlsruhe (Germany) (DE), KU Leuven (BE)
Openalex Percentile: Top 62%
Nanofabrication and Lithography Techniques
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