Plasmonic Characteristics of TiN Layers Deposited by ECWR Assisted MF Magnetron Sputtering

ABSTRACT This study investigates the plasmonic properties of TiN thin films deposited by pulsed mid‐frequency reactive magnetron sputtering combined with RF inductively coupled plasma in a DC magnetic field and electron cyclotron wave resonance (ECWR). The substrate was grounded while the plasma potential was tuned by applying a positive DC bias from 0 to 120 V to the ECWR coil relative to ground. Raising the DC bias increased the plasma potential and thus accelerated ions to energies corresponding to that potential, producing energetic ion bombardment of the grounded substrate. The principal benefit of adding ECWR plasma and a DC bias is an increased degree of ionization in the reactive plasma. Consequently, the resulting denser plasma and enhanced N 2 dissociation improve the internal structure of the deposited films even at low substrate temperatures.

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Publication Details

Journal
Advanced Physics Research
Published
2025-12-08
DOI
https://doi.org/10.1002/apxr.202500166
Primary Topic
Metal and Thin Film Mechanics
Type
article
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Plasmonic Characteristics of TiN Layers Deposited by ECWR Assisted MF Magnetron Sputtering

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Plasmonic Characteristics of TiN Layers Deposited by ECWR Assisted MF Magnetron Sputtering

Lukáš Vaclavek, Aneta Písaříková, M. Hrabovský, Zdeněk Hubička, L. Nožka, Jan Krajczewski, Jan Tomáštík, Petr Schovánek
article en

Abstract

ABSTRACT This study investigates the plasmonic properties of TiN thin films deposited by pulsed mid‐frequency reactive magnetron sputtering combined with RF inductively coupled plasma in a DC magnetic field and electron cyclotron wave resonance (ECWR). The substrate was grounded while the plasma potential was tuned by applying a positive DC bias from 0 to 120 V to the ECWR coil relative to ground. Raising the DC bias increased the plasma potential and thus accelerated ions to energies corresponding to that potential, producing energetic ion bombardment of the grounded substrate. The principal benefit of adding ECWR plasma and a DC bias is an increased degree of ionization in the reactive plasma. Consequently, the resulting denser plasma and enhanced N 2 dissociation improve the internal structure of the deposited films even at low substrate temperatures.

Advanced Physics ResearchVol. 5(1)
Warsaw University of Technology (PL), Czech Academy of Sciences (CZ), Czech Academy of Sciences, Institute of Sociology (CZ), FZU ‒ Institute of Physics of the Academy of Sciences of the Czech Republic (CZ), University of Warsaw (PL), Palacký University Olomouc (CZ)
Openalex Percentile: Top 57%
Metal and Thin Film Mechanics
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