Direct measurement of the electron wind force in cobalt nanowires
Copper back-end-of-line interconnects have been the industry standard for decades, but copper's susceptibility to electromigration failure has motivated a search for alternatives. While cobalt's resistivity is higher than copper's in bulk form, it scales more slowly with decreasing interconnect size, making cobalt a promising alternative for highly scaled interconnects. To better understand the electromigration behavior of cobalt, we map both temperature- and the current-induced strain in cobalt nanowires using a scanning transmission electron microscope equipped with an electron energy loss spectrometer. We consistently see cobalt move away from the anode, and we find cobalt's effective ionic charge Z*=+2±1 near 300 °C. This result will inform the design of highly scaled cobalt interconnects.
Authors
- Brian Zutter (ORCID: https://orcid.org/0000-0002-3604-5791)
- Yueyun Chen (ORCID: https://orcid.org/0009-0008-4325-068X)
- B. C. Regan (ORCID: https://orcid.org/0000-0003-3923-2688)
- Matthew Mecklenburg (ORCID: https://orcid.org/0000-0003-0581-4153)
- Ho Leung Chan (ORCID: https://orcid.org/0009-0002-1132-8530)
- Jared J. Lodico (ORCID: https://orcid.org/0009-0008-8096-7911)
Institutions
- University of Southern California (US)
- California NanoSystems Institute (US)
- University of California, Los Angeles (US)
Publication Details
- Journal
- Applied Physics Letters
- Published
- 2025-12-08
- DOI
- https://doi.org/10.1063/5.0304171
- Primary Topic
- Copper Interconnects and Reliability
- Type
- article
- Field-Weighted Citation Impact
- 0.00