Enhanced Thermal Conductivity in Tough and Environmentally Resilient Hydrogels

ABSTRACT Hydrogels, known for their biocompatibility and responsiveness to external stimuli, are promising candidates for wearable sensors and electronics. However, conventional hydrogels exhibit low thermal conductivity (0.2–0.6 W/m·K), which limits efficient heat dissipation and leads to performance degradation during continuous operation, such as in long‐term wearable health monitors. Moreover, their weak mechanical and environmental stability further constrains their broader applications. In this study, we introduce a multiscale structural engineering approach that leverages the dynamics of pores, crystallization, and hydrogen bonding. Inspired by the design motifs of natural materials such as spider silk, we enhance the thermal conductivity of hydrogels to 1.5 W/m·K. This multiscale structural strategy also improves their mechanical strength and environmental resilience. Our findings provide a blueprint for understanding the process–structure–property relationships and offer a design framework for expanding the practical applications of hydrogels.

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Publication Details

Journal
Advanced Materials Interfaces
Published
2025-12-07
DOI
https://doi.org/10.1002/admi.202500752
Primary Topic
Advanced Sensor and Energy Harvesting Materials
Type
article
Field-Weighted Citation Impact
0.00

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Enhanced Thermal Conductivity in Tough and Environmentally Resilient Hydrogels

Juan C. Mesa, Yuhyun Ji, Hyowon Lee, Jinheon Jeong et al.
Advanced Materials Interfaces
Advanced Sensor and Energy Harvesting Materials
article

Enhanced Thermal Conductivity in Tough and Environmentally Resilient Hydrogels

Juan C. Mesa, Yuhyun Ji, Hyowon Lee, Jinheon Jeong, Jonghun Yi, Claudia Benito Alston, Kate J. Won, Taewoong Park, Young L. Kim, Luis Solorio, Dong Rip Kim, Hyeonseo Joo, Chi Hwan Lee, Jiwon Lee, Young‐Jun Lee, Seokkyoon Hong
article en

Abstract

ABSTRACT Hydrogels, known for their biocompatibility and responsiveness to external stimuli, are promising candidates for wearable sensors and electronics. However, conventional hydrogels exhibit low thermal conductivity (0.2–0.6 W/m·K), which limits efficient heat dissipation and leads to performance degradation during continuous operation, such as in long‐term wearable health monitors. Moreover, their weak mechanical and environmental stability further constrains their broader applications. In this study, we introduce a multiscale structural engineering approach that leverages the dynamics of pores, crystallization, and hydrogen bonding. Inspired by the design motifs of natural materials such as spider silk, we enhance the thermal conductivity of hydrogels to 1.5 W/m·K. This multiscale structural strategy also improves their mechanical strength and environmental resilience. Our findings provide a blueprint for understanding the process–structure–property relationships and offer a design framework for expanding the practical applications of hydrogels.

Advanced Materials InterfacesVol. 13(2)
Purdue University West Lafayette (US), Hanyang University (KR)
National Science Foundation, Purdue University, Ministry of Trade, Industry and Energy, Korea Institute for Advancement of Technology, Division of Electrical, Communications and Cyber Systems, Division of Human Resource Development
Openalex Percentile: Top 62%
Advanced Sensor and Energy Harvesting Materials
DOIOpen Access PDFOpenAlex
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