Intrinsic Bistability Via Thick-Panel Design in High-Degrees-of-Freedom Resch Origami

Abstract Origami with high degrees-of-freedom (DOF), such as the Resch tessellation, offers a vast design space for complex morphing structures but poses significant control challenges. Embedding bistability is a promising strategy to simplify actuation, yet existing methods for creating intrinsic multistability are largely confined to kinematically simple, low-DOF patterns. This article presents a systematic computational framework to design intrinsically bistable thick-panel structures from high-DOF Resch origami. Our decoupled, two-stage approach first employs a stochastic gradient descent-based kinematic simulation to discover a viable, complex folded configuration from the vast design space of a zero-thickness model. Subsequently, it formulates a set of bi-compatibility constraints for both the unfolded and the target folded states, which are then efficiently solved using linear programming to determine the thick-panel geometry. The efficacy of the framework is demonstrated through the design and verification of two Resch-ori units: one with bistability between fully-flat and fully-folded states, and another between the flat and an arbitrarily prescribed spatial state. The bistability is numerically verified by analyzing the kinematic degrees-of-freedom and the minimum energy path between stable states. This work provides a robust and computationally efficient pathway for harnessing the complexity of high-DOF origami to create functional, bistable systems.

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Publication Details

Journal
Journal of Applied Mechanics
Published
2025-12-05
DOI
https://doi.org/10.1115/1.4070587
Primary Topic
Advanced Materials and Mechanics
Type
article
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article

Intrinsic Bistability Via Thick-Panel Design in High-Degrees-of-Freedom Resch Origami

Chang Sun, Fufu Yang, Li Yang, Yihao Fu et al.
Journal of Applied Mechanics
Advanced Materials and Mechanics
article

Intrinsic Bistability Via Thick-Panel Design in High-Degrees-of-Freedom Resch Origami

Chang Sun, Fufu Yang, Li Yang, Yihao Fu, Tong Zhou
article en

Abstract

Abstract Origami with high degrees-of-freedom (DOF), such as the Resch tessellation, offers a vast design space for complex morphing structures but poses significant control challenges. Embedding bistability is a promising strategy to simplify actuation, yet existing methods for creating intrinsic multistability are largely confined to kinematically simple, low-DOF patterns. This article presents a systematic computational framework to design intrinsically bistable thick-panel structures from high-DOF Resch origami. Our decoupled, two-stage approach first employs a stochastic gradient descent-based kinematic simulation to discover a viable, complex folded configuration from the vast design space of a zero-thickness model. Subsequently, it formulates a set of bi-compatibility constraints for both the unfolded and the target folded states, which are then efficiently solved using linear programming to determine the thick-panel geometry. The efficacy of the framework is demonstrated through the design and verification of two Resch-ori units: one with bistability between fully-flat and fully-folded states, and another between the flat and an arbitrarily prescribed spatial state. The bistability is numerically verified by analyzing the kinematic degrees-of-freedom and the minimum energy path between stable states. This work provides a robust and computationally efficient pathway for harnessing the complexity of high-DOF origami to create functional, bistable systems.

Journal of Applied MechanicsVol. 93(3)
Shenzhen University (CN), Danish Technological Institute (DK), Wuhan University (CN), Institute of Microelectronics (SG), City University of Hong Kong, Shenzhen Research Institute (CN), Wuhan Business University (CN), Institute of Microelectronics (CN), Fraunhofer Institute for Integrated Circuits (DE), University of Chinese Academy of Sciences (CN), Hubei University (CN), Fuzhou University (CN), Wuhan Institute of Technology (CN)
Openalex Percentile: Top 60%
Advanced Materials and Mechanics
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