Thermal Enhancement of LED Cooling Systems Using Passive Tesla Valves for Turbulence-Induced Convection

This study presents an experimental methodology for assessing the thermal behavior of high-power Chip-On-Board (COB) light-emitting diodes (LEDs) using infrared thermography, integrated with a novel compact forced-convection cooling device. The thermal performance was evaluated under varying power inputs and flow rates, revealing the system's ability to maintain LED junction temperatures below critical thresholds. Thermographic imaging enabled the spatially resolved temperature analysis of the LED surface under both natural and forced convection regimes. The proposed cooling device was specifically designed for compact integration, featuring a radial inlet/outlet configuration that minimizes space while maximizing heat dissipation efficiency. The simulation results generated were validated against experimental data, ensuring the reliability of the proposed cooling approach. This work demonstrates a feasible and replicable method for thermal management characterization in solid-state lighting applications, providing a scalable solution for integration in confined environments, such as LED luminaires, smart lighting systems, or embedded electronic modules.