Wettability-Controlled Hydrophobic Coating of CMP Component Using PTFE and DLC for Mitigating Slurry Agglomeration and Contamination

The chemical mechanical polishing (CMP) process in semiconductor fabrication faces challenges such as slurry agglomeration, scratches, and contamination, which degrade process reliability and device quality. To mitigate these challenges, this study investigated the application of hydrophobic surface coatings on CMP components. Polytetrafluorothylene (PTFE) was deposited onto stainless steel substrates, while diamond-like carbon (DLC) films were coated on PEEK-based retainer rings, with material selection guided by their surface energy characteristics and mechanical robustness. The hydrophobic performance of the coatings was systematically evaluated through contact angle measurements and surface roughness analysis (Ra, Rpk, Sa, Spk). Under oxide CMP conditions, 60 h reliability tests using non-patterned wafers demonstrated that PTFE-coated stainless-steel surfaces significantly reduced slurry-induced particle accumulation and suppressed scratches compared with uncoated substrates. In addition, PTFE provided stable hydrophobicity and effective scratch resistance, while DLC exhibited superhydrophobic behavior with contact angles exceeding 160°, offering potential for even greater protection against surface damage. The wettability of DLC coatings was further tunable via sp³/sp² carbon bonding ratios and surface roughness, consistent with the predictions of the Cassie-Baxter and Wenzel models. These findings establish a framework for surface modification of CMP hardware. The integration of PTFE and DLC coatings effectively enhances hydrophobicity, suppresses slurry contamination, and improves scratch reliability, thereby offering a practical route for designing hydrophobic CMP components that strengthen process stability and extend equipment lifetime in advanced semiconductor manufacturing.