Investigation of Processing Conditions and Product Geometry in Out-Mold Decoration and Their Effects on Film Adhesion and Deformation
The growing demand for high-quality decorative polymer surfaces has increased interest in Out Mold Decoration (OMD), yet the combined influence of processing conditions and product geometry on film adhesion and deformation remains insufficiently defined. This study establishes an integrated framework that connects OMD process parameters with geometry-dependent deformation behavior using polycarbonate films printed with an ink grid. Adhesion and surface quality were evaluated using 2.5D specimens, while 3D models with varied fillet radii, slopes, and heights enabled quantitative assessment of grid-spacing evolution and thickness distribution. Results show that preheating smooths the film without improving adhesion, whereas increasing the forming environment temperature enhances both bonding and surface quality within the material's thermal tolerance. Vacuum pressure strengthens film-substrate contact but requires moderation to prevent overstretching. An optimized condition of 100 °C preheating, 90 °C forming temperature, and 2.5 kg vacuum pressure provides a balanced performance. Geometric factors exert strong control over deformation, with small radii, steep slopes, and tall features producing greater strain and nonuniform thinning. These findings establish practical processing windows and geometry guidelines for achieving reliable OMD components that integrate high visual quality with stable adhesion performance.
Authors
- Hui-Li Chen
- Sheng-Hsun Hsu
- Po‐Wei Huang (ORCID: https://orcid.org/0000-0001-5681-2305)
- Jianyong Wu
Institutions
- Tainan University of Technology (TW)
- CTBC Business School (TW)
- Taiwan Semiconductor Manufacturing Company (Taiwan) (TW)
- China Steel (Taiwan) (TW)
Publication Details
- Journal
- Polymers
- Published
- 2025-12-05
- DOI
- https://doi.org/10.3390/polym17243239
- Primary Topic
- Injection Molding Process and Properties
- Type
- article
- Field-Weighted Citation Impact
- 0.00