Bidirectional interfacial interactions and Cu <sub> <i>x</i> </sub> S bond formation enabled by a thiourea-crosslinked binder for high-performance micro-SiO <sub> <i>x</i> </sub> anodes
The thiourea-crosslinked poly(acrylic acid- co -acrylamide) binder interacts strongly with Si, enhances interfacial adhesion with the Cu current collector, and alleviates Si's volume expansion to form a stable SEI layer.
Authors
- Senthil Kannan (ORCID: https://orcid.org/0000-0002-4169-9351)
- Taeeun Yim
- Tae‐Hyun Kim (ORCID: https://orcid.org/0000-0002-1654-3785)
- Chaeyoung Kim
- Seo Jin Yeon
- Jong Hyeok Han
Institutions
- Incheon National University (KR)
Publication Details
- Journal
- Journal of Materials Chemistry A
- Published
- 2025-12-05
- DOI
- https://doi.org/10.1039/d5ta08649c
- Primary Topic
- Silicon and Solar Cell Technologies
- Type
- article
- Field-Weighted Citation Impact
- 0.00