A study on interfacial structure design and thermal conductivity optimization of diamond/copper composites
By combining first-principles calculations and COMSOL simulations, this work obtained results that closely match the experimental findings.
Authors
- Bing Wang (ORCID: https://orcid.org/0000-0003-3739-734X)
- Ru‐Zhi Wang (ORCID: https://orcid.org/0000-0002-5430-2157)
- Zhanghui Liu (ORCID: https://orcid.org/0000-0002-5913-3647)
- Guojie Huang (ORCID: https://orcid.org/0000-0002-4054-9386)
- Jian Wang (ORCID: https://orcid.org/0000-0001-5130-300X)
- Dandan Li (ORCID: https://orcid.org/0000-0002-2220-6304)
- Jinsong Feng
- Yu Jiang (ORCID: https://orcid.org/0000-0003-3409-0916)
- Bo Peng (ORCID: https://orcid.org/0009-0009-0527-5322)
Institutions
- Beijing University of Technology (CN)
- China Nonferrous Metal Mining (China) (CN)
- Guilin University of Electronic Technology (CN)
- Beijing University of Chemical Technology (CN)
Publication Details
- Journal
- Materials Advances
- Published
- 2025-12-05
- DOI
- https://doi.org/10.1039/d5ma01082a
- Primary Topic
- Aluminum Alloys Composites Properties
- Type
- article
- Field-Weighted Citation Impact
- 0.00