Study on the Room-Temperature Rapid Curing Behavior and Mechanism of HDI Trimer-Modified Epoxy Resin

This study resolves the challenge of balancing curing speed and performance in room-temperature-curing epoxy coatings by developing a novel system grafted with hexamethylene diisocyanate trimer (HDI trimer) and polyethylene glycol 200 (PEG200). Employing DMP-30 as the catalyst, the coating achieves efficient curing at 25 °C, with complete cure within 7.5 h. The cured material exhibits outstanding thermal stability (T50% = 380.83 °C) and mechanical properties. Fracture morphology analysis reveals a uniform ductile structure, confirming its high toughness and durability. Furthermore, kinetic models accurately predict curing behavior across different temperature curves, providing crucial guidance for optimizing industrial coating processes. This research offers a viable strategy for designing high-performance, rapid curing epoxy materials, demonstrating significant application potential in coating systems, composite surfaces, and electronic encapsulation.