Interaction of Silicon Nitride Microparticles With Fluorinated Polyimide Films Including Fluorine Based on Particle Dissociation Technique in Acoustic–Gravitational Field

ABSTRACT Surface interactions critically govern the adhesion and stability of composite materials used in electronic and structural devices. However, quantitative evaluation of microscopic interfacial forces remains challenging due to the limitations of conventional techniques such as quartz crystal microbalance and atomic force microscopy. To address this issue, a particle dissociation technique based on a coupled acoustic–gravitational (CAG) field was employed to quantify the interactions between silicon nitride particles (SNPs) and polyimide (PI) films with different fluorine contents. In this method, the applied acoustic radiation force required for particle dissociation was translated into the dissociation voltage ( V ), providing a quantitative measure of interfacial binding strength on the order of several hundred piconewtons. This study is positioned within the field of materials and surface science, aiming to establish an acoustically driven analytical approach for quantifying adhesion strength at solid–solid interfaces. Unmodified PI film showed a higher V (33.5 V) than glass (19.1 V), indicating hydrogen‐bonding interactions, whereas fluorinated PI films exhibited lower V values (23.5–26.1 V) due to weaker fluorine–silicon affinity. A PI film with moderate fluorine content displayed two distinct dissociation profiles, reflecting the coexistence of hydrogen‐bonding and fluorine–silicon interactions. The CAG‐based particle dissociation method thus provides a versatile tool for quantitative analysis of interfacial adhesion in functional thin films.