Application of Phase Change Material for On-board Processing Payload – Simulations and Testing

With rising demands for on-board data processing come thermal challenges associated with increased power requirements of the processing payload. High power dissipation in spacecraft electronics often leads to undesirable operational temperatures (exceeding 75°C). Moreover, periodic duty cycles create thermal cycling that diminishes component reliability. To address these issues KP Labs proposes a novel Data Processing Unit (DPU), that incorporates Phase Change Material (PCM) technology to act as a thermal capacitor. This approach embeds PCM within a 3D-printed, aluminum mechanical enclosure at the module level. The goal of this design is to absorb heat directly from highly dissipative chips during hot operational phases and release it during low-power duty cycles. By reducing temperature fluctuations, this design enhances the reliability of spacecraft electronics. The key novelty of this solution lays in integrating PCM technology within the electronic modules compliant with SpaceVPX and ADHA (developed by ESA) standards. KP Labs’ manufactured and tested such assembly based on in-house developed DPU named Lion. The design was evaluated using detailed Finite Volume Method model (Simcenter FloEFD) and a simplified nodal model (ESATAN-TMS). The simplified model was used to accelerate computations and parametric studies, while the detailed model allowed to analyze the physical processes and design in detail. The thermal test campaign was performed in the Thermal Vacuum Chamber, demonstrating that the PCM-based system effectively mitigates temperature peaks, protects the electronics from overheating and reduces temperature amplitudes in the space environment thereby improving reliability. The tests confirmed the feasibility of utilizing additive manufacturing to incorporate PCM thermal management of space electronics at the module level. Results from simulations and TVAC testing will be presented during the conference enriched with recommendations for the scope of the application which could be beneficial for engineering and scientific communities.