Multimodal Characterization of Sn‐Bi Solder Alloy Solidification Using Synchrotron X‐Ray Microtomography and Energy Dispersive Diffraction

Multimodal Solidification Characterization In their Research Article (10.1002/adem.202501408), Nikhilesh Chawla and co-workers demonstrate the first simultaneous, time-resolved 4D X-ray microtomography and energy-dispersive diffraction analysis of Sn-Bi solder alloy solidification. The multimodal approach captures the nucleation and faceted growth of primary Bi crystals, the formation of Sn dendrites, and eutectic microstructures, while correlating diffraction peak intensities with phase volume fractions. These insights enable a deeper, quantitative understanding of microstructural evolution and strain development during alloy solidification.

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Publication Details

Journal
Advanced Engineering Materials
Published
2025-12-01
DOI
https://doi.org/10.1002/adem.70360
Primary Topic
Electronic Packaging and Soldering Technologies
Type
article
Field-Weighted Citation Impact
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article

Multimodal Characterization of Sn‐Bi Solder Alloy Solidification Using Synchrotron X‐Ray Microtomography and Energy Dispersive Diffraction

Nikhilesh Chawla, Alan Kastengren, Amey Luktuke, John A. Wu
Advanced Engineering Materials
Electronic Packaging and Soldering Technologies
article

Multimodal Characterization of Sn‐Bi Solder Alloy Solidification Using Synchrotron X‐Ray Microtomography and Energy Dispersive Diffraction

Nikhilesh Chawla, Alan Kastengren, Amey Luktuke, John A. Wu
article en

Abstract

Multimodal Solidification Characterization In their Research Article (10.1002/adem.202501408), Nikhilesh Chawla and co-workers demonstrate the first simultaneous, time-resolved 4D X-ray microtomography and energy-dispersive diffraction analysis of Sn-Bi solder alloy solidification. The multimodal approach captures the nucleation and faceted growth of primary Bi crystals, the formation of Sn dendrites, and eutectic microstructures, while correlating diffraction peak intensities with phase volume fractions. These insights enable a deeper, quantitative understanding of microstructural evolution and strain development during alloy solidification.

Advanced Engineering MaterialsVol. 27(23)
Argonne National Laboratory (US), Purdue University West Lafayette (US)
Openalex Percentile: Top 62%
Electronic Packaging and Soldering Technologies
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