Multimodal Characterization of Sn‐Bi Solder Alloy Solidification Using Synchrotron X‐Ray Microtomography and Energy Dispersive Diffraction
Multimodal Solidification Characterization In their Research Article (10.1002/adem.202501408), Nikhilesh Chawla and co-workers demonstrate the first simultaneous, time-resolved 4D X-ray microtomography and energy-dispersive diffraction analysis of Sn-Bi solder alloy solidification. The multimodal approach captures the nucleation and faceted growth of primary Bi crystals, the formation of Sn dendrites, and eutectic microstructures, while correlating diffraction peak intensities with phase volume fractions. These insights enable a deeper, quantitative understanding of microstructural evolution and strain development during alloy solidification.
Authors
- Nikhilesh Chawla (ORCID: https://orcid.org/0000-0002-4478-8552)
- Alan Kastengren (ORCID: https://orcid.org/0000-0003-0253-6258)
- Amey Luktuke (ORCID: https://orcid.org/0000-0002-2292-6897)
- John A. Wu (ORCID: https://orcid.org/0000-0001-7708-3551)
Institutions
- Argonne National Laboratory (US)
- Purdue University West Lafayette (US)
Publication Details
- Journal
- Advanced Engineering Materials
- Published
- 2025-12-01
- DOI
- https://doi.org/10.1002/adem.70360
- Primary Topic
- Electronic Packaging and Soldering Technologies
- Type
- article
- Field-Weighted Citation Impact
- 0.00