Advances in Soft Solid State Electrocaloric Refrigeration

Abstract Electrocaloric cooling has emerged as a promising solid‐state substitute for traditional vapor‐compression refrigeration, driven by the need for environmentally friendly and energy‐efficient technologies. This review hightlights recent advances in ceramic ferroelectrics in multilayer ceramic capacitors (MLCCs) and polyvinylidene fluoride (PVDF) copolymers‐based efficient, self‐oscillating soft refrigeration systems. The introduction of lead‐free ceramic ferroelectrics in MLCCs has significantly enhanced the performance and durability of electrocaloric cooling systems, making them energy‐efficient and capable of withstanding extensive operational cycles. Simultaneously, ternary copolymers, P(VDF‐TrFE‐CFE) and P(VDF‐TrFE‐CTFE) along with their composites and modified derivatives have demonstrated superior promise due to their enhanced polarization‐field coupling and fatigue resistance compared to irradiated copolymers. These systems leverage their high thermal conductivity and substantial electrocaloric responses to facilitate rapid heat dissipation without external mechanical components, enabling efficient electronic thermal management. The synergy between electro‐thermomechanical properties has paved the way for these solid‐state cooling technologies to potentially replace conventional systems, reducing energy consumption and eliminating the use of harmful refrigerants. This review underscores the pivotal role of molecular and interface engineering in eco‐friendly electrocaloric cooling solutions, focusing on enhancing cooling efficiency through optimized thermal load management, strategic dipole alignment to improve polarization‐field interaction, and the development of ceramic multilayer capacitors and irradiated P(VDF‐TrFE) with large adiabatic temperature changes and high energy densities, promising electronic thermal management and on‐chip cooling in advanced computing and telecommunications.

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Publication Details

Journal
Advanced Functional Materials
Published
2025-12-03
DOI
https://doi.org/10.1002/adfm.202506625
Citations
1
Primary Topic
Dielectric materials and actuators
Type
article
Field-Weighted Citation Impact
0.67
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article

Advances in Soft Solid State Electrocaloric Refrigeration

Songyue Chen, Shumao Xu, Xiujun Fan, Jun Chen et al.
1 citations
Advanced Functional Materials
Dielectric materials and actuators
0.67
article

Advances in Soft Solid State Electrocaloric Refrigeration

Songyue Chen, Shumao Xu, Xiujun Fan, Jun Chen, Jeong Min Baik
article en
1 citations

Abstract

Abstract Electrocaloric cooling has emerged as a promising solid‐state substitute for traditional vapor‐compression refrigeration, driven by the need for environmentally friendly and energy‐efficient technologies. This review hightlights recent advances in ceramic ferroelectrics in multilayer ceramic capacitors (MLCCs) and polyvinylidene fluoride (PVDF) copolymers‐based efficient, self‐oscillating soft refrigeration systems. The introduction of lead‐free ceramic ferroelectrics in MLCCs has significantly enhanced the performance and durability of electrocaloric cooling systems, making them energy‐efficient and capable of withstanding extensive operational cycles. Simultaneously, ternary copolymers, P(VDF‐TrFE‐CFE) and P(VDF‐TrFE‐CTFE) along with their composites and modified derivatives have demonstrated superior promise due to their enhanced polarization‐field coupling and fatigue resistance compared to irradiated copolymers. These systems leverage their high thermal conductivity and substantial electrocaloric responses to facilitate rapid heat dissipation without external mechanical components, enabling efficient electronic thermal management. The synergy between electro‐thermomechanical properties has paved the way for these solid‐state cooling technologies to potentially replace conventional systems, reducing energy consumption and eliminating the use of harmful refrigerants. This review underscores the pivotal role of molecular and interface engineering in eco‐friendly electrocaloric cooling solutions, focusing on enhancing cooling efficiency through optimized thermal load management, strategic dipole alignment to improve polarization‐field interaction, and the development of ceramic multilayer capacitors and irradiated P(VDF‐TrFE) with large adiabatic temperature changes and high energy densities, promising electronic thermal management and on‐chip cooling in advanced computing and telecommunications.

Advanced Functional MaterialsVol. 36(6)
University of California, Los Angeles (US), Sungkyunkwan University (KR)
Openalex Percentile: Top 24%
Dielectric materials and actuators
0.67
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