Reliability Issues of Thick-Film Resistors in Embedded Piezoelectric Smart Aggregates for Strain Monitoring
This paper explores the challenges of applying thick-film resistors to natural stone substrates for smart aggregates used in structural health monitoring. The main challenges include ink absorption, microcracking from high-temperature sintering and inconsistent electrical performance. To enhance reliability, the research recommends substrate-specific surface treatments, tailored pastes, improved low-temperature processing and control methods.
Authors
- I. Stanimirović (ORCID: https://orcid.org/0000-0003-2445-611X)
- Z. Stanimirović (ORCID: https://orcid.org/0000-0002-2048-0027)
- Pavle Stanimirović (ORCID: https://orcid.org/0009-0001-3437-8373)
Institutions
- University of Belgrade (RS)
- Institute of Physics Belgrade (RS)
Publication Details
- Published
- 2025-10-13
- DOI
- https://doi.org/10.1109/miel66332.2025.11261034
- Primary Topic
- Electrical and Thermal Properties of Materials
- Type
- article
- Field-Weighted Citation Impact
- 0.00