Experimental and theoretical study of the microstructures in rapidly solidified Cu–75 at% Sn alloy

The microstructure of Cu alloys has attracted increasing interest for the development of fluoride-ion batteries (FIBs), owing to their potential as cathode materials. However, the mechanisms governing non-equilibrium microstructural evolution in Cu–Sn alloys, particularly those affecting F-ion transport pathways, remain insufficiently understood. In this study, we investigate the microstructural evolution of a Cu–75 at% Sn alloy prepared by rapid solidification followed by thermal aging, with a particular focus on the role of Sn as a potential diffusion pathway for F ions. Transmission electron microscopy (TEM) and scanning TEM (STEM) analyses reveal nanoscale compositional modulations that form alternating Cu-rich and Cu-poor domains, reminiscent of spinodal decomposition, in the rapidly solidified state. Rapid solidification also promotes interstitial incorporation of Cu into the β-Sn phase, increasing the Cu solubility up to 1.65 at% and inducing lattice contraction. During subsequent aging, Cu atoms redistribute, resulting in the recovery of the β-Sn lattice parameter, as supported by first-principles calculations and STEM–energy-dispersive X-ray spectroscopy. These findings provide fundamental insights into the non-equilibrium microstructural modulation of Cu–Sn alloys and offer useful guidelines for tailoring cathode materials for next-generation FIBs. • Rapid solidification suppressed Cu₃Sn formation, yielding a microstructure of β-Sn and Cu₆Sn₅ with refined grains and lattice disorder. • Thermal aging drove structural recovery and Cu redistribution, sharpening diffraction peaks, restoring lattice parameters, and forming secondary Cu₃Sn. • Hardness rose in rapidly solidified samples due to nanoscale modulation from spinodal decomposition, but fell after aging from domain coarsening and homogenization. • DFT and STEM-EDS showed Cu solubility in β-Sn rises under rapid solidification via interstitial Cu and lattice contraction.

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Publication Details

Journal
Journal of Alloys and Compounds
Published
2025-12-01
DOI
https://doi.org/10.1016/j.jallcom.2025.185408
Primary Topic
Advancements in Battery Materials
Type
article
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article

Experimental and theoretical study of the microstructures in rapidly solidified Cu–75 at% Sn alloy

Di Wu, Tomoharu Tokunaga, S. Iikubo, Yongpeng Tang et al.
Journal of Alloys and Compounds
Advancements in Battery Materials
article

Experimental and theoretical study of the microstructures in rapidly solidified Cu–75 at% Sn alloy

Di Wu, Tomoharu Tokunaga, S. Iikubo, Yongpeng Tang, H. Akamine, Ryo Ishibashi, Y. Shimada
article en

Abstract

The microstructure of Cu alloys has attracted increasing interest for the development of fluoride-ion batteries (FIBs), owing to their potential as cathode materials. However, the mechanisms governing non-equilibrium microstructural evolution in Cu–Sn alloys, particularly those affecting F-ion transport pathways, remain insufficiently understood. In this study, we investigate the microstructural evolution of a Cu–75 at% Sn alloy prepared by rapid solidification followed by thermal aging, with a particular focus on the role of Sn as a potential diffusion pathway for F ions. Transmission electron microscopy (TEM) and scanning TEM (STEM) analyses reveal nanoscale compositional modulations that form alternating Cu-rich and Cu-poor domains, reminiscent of spinodal decomposition, in the rapidly solidified state. Rapid solidification also promotes interstitial incorporation of Cu into the β-Sn phase, increasing the Cu solubility up to 1.65 at% and inducing lattice contraction. During subsequent aging, Cu atoms redistribute, resulting in the recovery of the β-Sn lattice parameter, as supported by first-principles calculations and STEM–energy-dispersive X-ray spectroscopy. These findings provide fundamental insights into the non-equilibrium microstructural modulation of Cu–Sn alloys and offer useful guidelines for tailoring cathode materials for next-generation FIBs. • Rapid solidification suppressed Cu₃Sn formation, yielding a microstructure of β-Sn and Cu₆Sn₅ with refined grains and lattice disorder. • Thermal aging drove structural recovery and Cu redistribution, sharpening diffraction peaks, restoring lattice parameters, and forming secondary Cu₃Sn. • Hardness rose in rapidly solidified samples due to nanoscale modulation from spinodal decomposition, but fell after aging from domain coarsening and homogenization. • DFT and STEM-EDS showed Cu solubility in β-Sn rises under rapid solidification via interstitial Cu and lattice contraction.

Journal of Alloys and CompoundsVol. 1049
Openalex Percentile: Top 62%
Advancements in Battery Materials
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