Interfacial thermal conductance between a spin-ladder cuprate (La <sub>5</sub> Ca <sub>9</sub> Cu <sub>24</sub> O <sub>41</sub> ) and a metal film: the role of surface defects in cuprates
Thermal switching is an invaluable technique for advanced thermal management and enables highly efficient reuse of thermal energy and improves the performance of various devices that are impacted by waste heat.
Authors
- Nobuaki Terakado (ORCID: https://orcid.org/0000-0002-7291-8828)
- Taiichi Katayama (ORCID: https://orcid.org/0000-0001-8137-0481)
- Takayuki Kawamata (ORCID: https://orcid.org/0000-0003-0492-6612)
- Yoshihiro Takahashi (ORCID: https://orcid.org/0009-0000-8827-4601)
- Takumi Fujiwara
- Chitose Ishikawa
- Koki Naruse
Institutions
- Tokyo Denki University (JP)
- Tohoku University (JP)
Publication Details
- Journal
- Journal of Materials Chemistry C
- Published
- 2025-12-02
- DOI
- https://doi.org/10.1039/d5tc01945a
- Primary Topic
- Magnetic and transport properties of perovskites and related materials
- Type
- article
- Field-Weighted Citation Impact
- 0.00