Investigation on the magnetic abrasive finishing performance and plastic deformation mechanism of copper

This study experimentally investigates the finishing performance of the magnetic abrasive finishing (MAF) method driven by a varying magnetic field on single-crystal copper, and elucidates the plastic deformation mechanism of copper during nano-finishing using molecular dynamics simulations. First, the effects of grinding fluid, magnetic pole rotational speed, and current frequency on the surface roughness and material removal amount of copper were examined via comparative experiments. Using a varying magnetic field for two-stage finishing, the final surface roughness of copper reached 6.5 nm. Molecular dynamics simulations were further employed to analyze the plastic deformation mechanism of copper during ultra-precision finishing. The simulation results reveal that the plastic deformation of copper arises from the flow of amorphous and HCP phases, accompanied by near-atomic-scale defects such as stacking faults, dislocations, and severe lattice distortions. This study clarifies the crystal deformation and damage mechanisms of copper during ultra-precision finishing, providing valuable insight for achieving high-efficiency, high-accuracy manufacturing of copper components.