Mechanisms of electroplasticity-assisted nano-cutting of polycrystalline SiCp/Al composites: A molecular dynamics simulation study

A molecular dynamics model for the electroplasticity-assisted nano-cutting of polycrystalline SiCp/Al has been developed, incorporating the electronic wind effect and Joule heating effect at the nanoscale. Through a comparison between conventional cutting and electroplasticity-assisted cutting processes in terms of material removal behavior, energy accumulation characteristics, cutting force, stress distribution, and crystal defect evolution patterns, the influence of the electroplastic effect on the plastic deformation of polycrystalline SiCp/Al composites has been investigated. The results demonstrate that electroplasticity-assisted cutting enhances the material removal rate, decreases the energy rise rate and cutting force, and expands the distribution range of amorphous atoms in the cutting region. Compared with conventional cutting, electroplasticity-assisted cutting achieves a 27.5% increase in the number of atoms removed, along with reductions in the resultant cutting force and its X-, Y-, and Z-direction components of 16.3%, 39.7%, 15.7%, and 17.2%, respectively. Under the influence of an electric current, the Joule heating effect raises the temperature of the material, resulting in a reduction in hardness. Simultaneously, the electron wind force acts upon dislocations, promoting dislocation movement and multiplication. The synergistic effect of the two enhances atomic-scale plastic flow, improving the overall plastic deformation capacity of the material. These findings clarify the role of the electroplastic effect in the plastic deformation of polycrystalline SiCp/Al composites, providing theoretical support for optimizing machining processes for SiCp/Al composites in industrial applications.