High-Density Optical Packaging Technology for Co-Packaged Optics

Authors

Takeru Amano (ORCID: https://orcid.org/0000-0002-4006-0716)

Publication Details

Journal: The Journal of the Institute of Electrical Engineers of Japan
Published: 2025-11-30
DOI: https://doi.org/10.1541/ieejjournal.145.718
Primary Topic: 3D IC and TSV technologies
Type: article
Field-Weighted Citation Impact: 0.00

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article

High-Density Optical Packaging Technology for Co-Packaged Optics

Takeru Amano

Nov 30, 2025

The Journal of the Institute of Electrical Engineers of Japan

3D IC and TSV technologies

article

High-Density Optical Packaging Technology for Co-Packaged Optics

Takeru Amano

November 30, 2025article en

Abstract

No abstract available for this paper.

The Journal of the Institute of Electrical Engineers of JapanVol. 145(12)

Openalex Percentile: Top 63%

3D IC and TSV technologies

DOI Source OpenAlex

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High-Density Optical Packaging Technology for Co-Packaged Optics — Takeru Amano · The Journal of the Institute of Electrical Engineers of Japan (2025) | TGRS Research Map | TGRS