On‐Chip Perovskite Coolers

ABSTRACT The rapid scaling of electronic systems and 3D integration in advanced semiconductor packaging has led to critical thermal management challenges. Traditional cooling methods such as forced convection or immersion cooling face SWaP limitations, motivating the exploration of solid‐state, on‐chip alternatives. This perspective highlights three solid‐state cooling technologies, namely optical refrigeration, electroluminescent, and thermoelectric cooling, as promising approaches for localized, vibration‐free, and scalable thermal management. Optical refrigeration, leveraging anti‐Stokes photoluminescence to remove thermal energy via phonon upconversion, has shown significant progress in rare‐earth‐doped glass and semiconductors. Electroluminescent cooling, driven by carrier injection and photon emission, presents another promising path for thermal energy extraction under electrical bias. Thermoelectric devices, based on the Peltier effect, have been widely studied but remain limited by low figures of merit at ambient conditions. Among candidate materials, halide perovskites exhibit exceptional promise due to their solution‐processability, near‐unity photoluminescence quantum yield, tunable electronic structure, and unique electron–phonon coupling behavior. These features enable efficient phonon‐assisted upconversion, long hot‐carrier lifetimes, and suppressed non‐radiative losses, which are crucial for achieving net cooling. This work provides a mechanistic overview of solid‐state cooling strategies and outlines the design principles and materials challenges of Thermoelectric cooling, electroluminescent cooling, halide perovskites, optical refrigeration of halide perovskites for solid‐state on‐chip cooling.