The mechanisms of oxide dissolution evolution and mechanical properties transient liquid phase bonding of SSM 6063 aluminum alloy with zamak 2 binder

• Introduced GISS-processed SSM 6063 aluminum alloy—a novel semi-solid feedstock material not previously studied in TLP bonding applications. • Investigated the mechanisms of oxide dissolution and interfacial evolution during transient liquid phase bonding of the innovative SSM 6063 alloy using Zamak 2 interlayer. • Identified bonding temperature as the most influential factor governing oxide removal efficiency and mechanical bonding performance. • Achieved a maximum bonding strength of 23.56 MPa at an optimal condition of 450 °C for 120 minutes, revealing the potential of low-temperature TLP bonding and Developed a statistically robust ANOVA-based predictive model with 89.26 % accuracy for forecasting bonding strength and oxide volume across process parameters. • Detected key interfacial defects—such as oxide barriers, porosity, interfacial cracking, and incomplete joint formation—via high-resolution SEM-EDS analysis. This study investigates the mechanisms underlying oxide layer evolution and its influence on joint strength during transient liquid phase bonding (TLPB) of SSM 6063 aluminum alloy utilizing Zamak 2 as a binder. The persistent presence of residual oxides in aluminum bonding significantly impedes diffusion kinetics and compromises joint integrity, thereby necessitating a comprehensive investigation into oxide dissolution behavior. This research addresses this gap by systematically evaluating oxide characteristics under varying bonding temperatures (450, 500, and 550 °C) and bonding times (60 and 120 min), under constant bonding pressure and inert gas conditions. A full factorial design of experiments was implemented, and high-resolution microstructural analysis using SEM-EDS was employed to evaluate oxide distribution and interfacial diffusion. The optimal mechanical strength (23.56 MPa) was obtained at 450 °C and 120 min, while oxide formation was minimized. ANOVA revealed that bonding temperature was the most significant factor, followed by bonding time. The regression model explained 89.26 % of the total variation. Defects including cracks, porosity, interfacial separation, and oxide barriers were observed and found to significantly impact joint reliability.