Additively Printed Circuit Performance of Thermoformed In-Mold Electronics for Automotive Applications

Abstract The use of in-mold Electronics has the potential for transforming design and production of automotive systems through greater integration of form and function and lightweighting achieved by elimination of wire harnesses and connectors. IME can facilitate the smooth integration of electronic circuits into intricate three-dimensional surfaces. Nevertheless, despite the potential for providing numerous benefits, the technology transition of additive IME circuits is still lacking. It is still unclear how important manufacturing factors, such as substrate deformation, ink conductivity, and mechanical stress, affect circuit performance. The purpose of this study is to look into how the electrical performance of IME circuits made for automotive applications is affected by screen-printing and thermoforming settings. This study offers important insights into the viability and dependability of IME technology in actual automotive settings by examining resistance fluctuations, capacitance stability, and overall circuit performance both before and after thermoforming. The results facilitate IME's wider implementation in next-generation vehicle electronics by advancing our understanding of its design and optimization.