Molecular Layer Deposited Aluminum‐Based Hybrid Resist for High‐Resolution Nanolithography and Direct Ultra‐High Aspect Ratio Pattern Transfer

Abstract Inorganic‐containing hybrid photoresists are critical for next‐generation extreme ultraviolet (EUV) lithography and angstrom‐era semiconductor miniaturization. However, associated conventional solution processing struggles to achieve ultrathin, uniform films with high conformality and compositional control, limiting overall patterning performance. Here, this study reports the systematic lithographic patterning characterization of an Al‐based hybrid resist synthesized via vapor‐phase molecular layer deposition (MLD), using the trimethylaluminum (TMA) metal precursor and the hydroquinone (HQ) aromatic organic linker. The resist supports both sub‐20 nm high‐resolution nanolithography and virtually infinite silicon plasma etch selectivity. Lithographic performance studied using electron beam lithography (EBL) as a proxy for EUV shows that, under an optimized process adopting post‐exposure bake, the resist achieves the best resolution of 15.4 nm linewidth under stringent 1:1 line‐space high‐density patterning—limited only by the minimum beam size of the EBL system. The resist also shows wide dose latitude and balanced performance in resolution, roughness, and sensitivity. The infinite silicon etch selectivity, stemming from spontaneous aluminum oxyfluoride passivation layer formation, enables fabrication of micrometer‐tall, 40 nm‐wide silicon nanofin structures using only a ≈30 nm‐thick resist layer, without no hard mask. These results highlight the potential of MLD‐based hybrid resists for developing next‐generation resist materials for micro/nanoelectronics manufacturing.