Dual‐mode strategy for sintering‐stability and bonding of SLA additively manufactured ceramic green bodies

Abstract Stereolithography‐based ceramic additive manufacturing enables the fabrication of intricate monolithic components; however, geometric design freedom remains limited by green‐body fragility and sintering‐induced deformation in overhanging geometries. To overcome these limitations, this study introduces a dual‐mode green‐state strategy where printed ceramic parts serve two roles: (1) bonding elements , printed separately and joined with UV‐curable ceramic resin for co‐sintered monolithic assemblies and (2) non‐bonding support structures , positioned in dry contact beneath overhanging features to temporarily support them during sintering, preventing deformation. Mechanical performance of bonded joints are evaluated through four‐point bending, Weibull analysis across three joint configurations, varying in mechanical interlock and stress distribution characteristics, and benchmarked against monolithic baselines. Monolithic samples exhibited the highest strength ( MPa, ). Among bonded geometries, face‐edge joints (normal and aligned to build direction)—where a flat surface is bonded perpendicularly to the edge of another segment retained the highest strength at 60.6% of monolithic baselines ( MPa, ). Nonbonding support structures, placed in dry contact beneath overhanging features, exhibited synchronous shrinkage during sintering reducing distortion from 1 mm to below measurement resolution, addressing critical barriers in ceramic AM.

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Publication Details

Journal
International Journal of Applied Ceramic Technology
Published
2025-11-26
DOI
https://doi.org/10.1111/ijac.70121
Primary Topic
Additive Manufacturing and 3D Printing Technologies
Type
article
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article

Dual‐mode strategy for sintering‐stability and bonding of SLA additively manufactured ceramic green bodies

Lynnora O. Grant, Stuart T. Smith, Anand Rathnam
International Journal of Applied Ceramic Technology
Additive Manufacturing and 3D Printing Technologies
article

Dual‐mode strategy for sintering‐stability and bonding of SLA additively manufactured ceramic green bodies

Lynnora O. Grant, Stuart T. Smith, Anand Rathnam
article en

Abstract

Abstract Stereolithography‐based ceramic additive manufacturing enables the fabrication of intricate monolithic components; however, geometric design freedom remains limited by green‐body fragility and sintering‐induced deformation in overhanging geometries. To overcome these limitations, this study introduces a dual‐mode green‐state strategy where printed ceramic parts serve two roles: (1) bonding elements , printed separately and joined with UV‐curable ceramic resin for co‐sintered monolithic assemblies and (2) non‐bonding support structures , positioned in dry contact beneath overhanging features to temporarily support them during sintering, preventing deformation. Mechanical performance of bonded joints are evaluated through four‐point bending, Weibull analysis across three joint configurations, varying in mechanical interlock and stress distribution characteristics, and benchmarked against monolithic baselines. Monolithic samples exhibited the highest strength ( MPa, ). Among bonded geometries, face‐edge joints (normal and aligned to build direction)—where a flat surface is bonded perpendicularly to the edge of another segment retained the highest strength at 60.6% of monolithic baselines ( MPa, ). Nonbonding support structures, placed in dry contact beneath overhanging features, exhibited synchronous shrinkage during sintering reducing distortion from 1 mm to below measurement resolution, addressing critical barriers in ceramic AM.

International Journal of Applied Ceramic TechnologyVol. 23(1)
University of North Carolina at Charlotte (US)
Openalex Percentile: Top 60%
Additive Manufacturing and 3D Printing Technologies
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Dual‐mode strategy for sintering‐stability and bonding of SLA additively manufactured ceramic green bodies — Lynnora O. Grant, Stuart T. Smith, et al. · International Journal of Applied Ceramic Technology (2025) | TGRS Research Map | TGRS