Atomic layer deposition of Ru using a new zero-valent Ru precursor with a ligand system combining open and closed ligands

A newly designed zero-valent Ru precursor combining open and closed ligands enables atomic layer deposition of low-resistivity, highly conformal Ru thin films with exceptional thermal stability and growth performance.

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Publication Details

Journal
Journal of Materials Chemistry C
Published
2025-11-26
DOI
https://doi.org/10.1039/d5tc03685b
Primary Topic
Semiconductor materials and devices
Type
article
Field-Weighted Citation Impact
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article

Atomic layer deposition of Ru using a new zero-valent Ru precursor with a ligand system combining open and closed ligands

Ji‐Hoon Ahn, Jinsik Kim, Chang Mo Yoon, Eun-Su Chung et al.
Journal of Materials Chemistry C
Semiconductor materials and devices
article

Atomic layer deposition of Ru using a new zero-valent Ru precursor with a ligand system combining open and closed ligands

Ji‐Hoon Ahn, Jinsik Kim, Chang Mo Yoon, Eun-Su Chung, Yoon-A Park, Min‐Ji Ha, Na-Gyeong Kang
article en

Abstract

A newly designed zero-valent Ru precursor combining open and closed ligands enables atomic layer deposition of low-resistivity, highly conformal Ru thin films with exceptional thermal stability and growth performance.

Journal of Materials Chemistry CVol. 14(4)
Pyeongtaek University (KR), Hanyang University (KR)
Openalex Percentile: Top 64%
Semiconductor materials and devices
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