Scalable Integration of Single-Crystalline Ag Nanosheets for Threshold Voltage Engineering in Oxide Thin-Film Transistors

Amorphous oxide semiconductor-based thin-film transistors (TFTs), particularly those utilizing indium gallium zinc oxide (IGZO), have garnered significant attention for next-generation display backplanes and flexible electronics. However, the precise and reliable modulation of threshold voltage (<i>V</i><sub>th</sub>) remains a persistent challenge, often requiring doping or vacancy engineering approaches that compromise process uniformity and device reliability. In this study, we introduce a scalable and low-temperature strategy for <i>V</i><sub>th</sub> tuning via the incorporation of two-dimensional (2D), single-crystalline silver nanosheets (Ag NSs) within the IGZO channel. These quasi-two-dimensional nanostructures have nanometer-scale thickness and lateral single crystallinity and are assembled using an ultrasonic-driven solution process that allows tunable coverage over large-area substrates. By varying Ag NS coverage up to 6.8%, we achieve a systematic and reproducible positive shift in <i>V</i><sub>th</sub>, with minimal degradation in mobility, on/off ratio, and subthreshold swing. Mechanistic studies using X-ray photoelectron spectroscopy and electrical bias stress testing reveal that the modulation arises from Schottky barrier formation and electrostatic screening at the Ag-IGZO interface rather than from modulation of oxygen vacancy concentrations. Devices incorporating Ag NSs exhibit excellent stability, with minimal hysteresis (Δ<i>V</i><sub>th</sub> ≈ 1 V), negligible parameter drift under a ±20 V gate bias stress for 60 min, and long-term retention after 390 days of ambient storage. To validate the circuit-level applicability of this method, we fabricated depletion-load NMOS inverters combining pristine and Ag NS-modified IGZO TFTs, wherein the switching threshold could be finely tuned via the Ag NS coverage. This work demonstrates a wafer-compatible and solution-processable route to deterministic <i>V</i><sub>th</sub> engineering in oxide TFTs, offering a promising platform for future high-performance, flexible, and large-area electronic systems.

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Journal
ACS Nano
Published
2025-11-14
DOI
https://doi.org/10.1021/acsnano.5c13526
Citations
1
Primary Topic
Thin-Film Transistor Technologies
Type
article
Field-Weighted Citation Impact
0.73
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article

Scalable Integration of Single-Crystalline Ag Nanosheets for Threshold Voltage Engineering in Oxide Thin-Film Transistors

Jae‐Keun Kim, Sukang Bae, Seoung‐Ki Lee, Seokhyeon Baek et al.
1 citations
ACS Nano
Thin-Film Transistor Technologies
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article

Scalable Integration of Single-Crystalline Ag Nanosheets for Threshold Voltage Engineering in Oxide Thin-Film Transistors

Jae‐Keun Kim, Sukang Bae, Seoung‐Ki Lee, Seokhyeon Baek, S.S. Kim, Byung Joon Moon, Hyeonji Joo, Tae‐Wook Kim, Do‐Hyung Kim, Sungjun Park, Daehong Kim, Sneha Bhise, Hee Yun Yang, Youngseok Song
article en
1 citations

Abstract

Amorphous oxide semiconductor-based thin-film transistors (TFTs), particularly those utilizing indium gallium zinc oxide (IGZO), have garnered significant attention for next-generation display backplanes and flexible electronics. However, the precise and reliable modulation of threshold voltage (<i>V</i><sub>th</sub>) remains a persistent challenge, often requiring doping or vacancy engineering approaches that compromise process uniformity and device reliability. In this study, we introduce a scalable and low-temperature strategy for <i>V</i><sub>th</sub> tuning via the incorporation of two-dimensional (2D), single-crystalline silver nanosheets (Ag NSs) within the IGZO channel. These quasi-two-dimensional nanostructures have nanometer-scale thickness and lateral single crystallinity and are assembled using an ultrasonic-driven solution process that allows tunable coverage over large-area substrates. By varying Ag NS coverage up to 6.8%, we achieve a systematic and reproducible positive shift in <i>V</i><sub>th</sub>, with minimal degradation in mobility, on/off ratio, and subthreshold swing. Mechanistic studies using X-ray photoelectron spectroscopy and electrical bias stress testing reveal that the modulation arises from Schottky barrier formation and electrostatic screening at the Ag-IGZO interface rather than from modulation of oxygen vacancy concentrations. Devices incorporating Ag NSs exhibit excellent stability, with minimal hysteresis (Δ<i>V</i><sub>th</sub> ≈ 1 V), negligible parameter drift under a ±20 V gate bias stress for 60 min, and long-term retention after 390 days of ambient storage. To validate the circuit-level applicability of this method, we fabricated depletion-load NMOS inverters combining pristine and Ag NS-modified IGZO TFTs, wherein the switching threshold could be finely tuned via the Ag NS coverage. This work demonstrates a wafer-compatible and solution-processable route to deterministic <i>V</i><sub>th</sub> engineering in oxide TFTs, offering a promising platform for future high-performance, flexible, and large-area electronic systems.

ACS NanoVol. 19(46)
ON Semiconductor (United States) (US), Korea Electric Power Corporation (South Korea) (KR), Max Planck Institute of Microstructure Physics (DE), Korea Institute of Materials Science (KR), Institute for Renewable Energy (Poland) (PL), Printed Electronics (United Kingdom) (GB), Pusan National University (KR), Ajou University (KR), Jeonbuk National University (KR)
Openalex Percentile: Top 21%
Thin-Film Transistor Technologies
0.73
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