A Theoretical Solution for Analyzing Bi-Layer Structures with Differing Thermal Properties

Based on the Hilbert-Riemann theory, this paper develops a simplified model to address interfacial fracture in bi-layer laminated solar cells with significantly dissimilar thermal properties. The model is used to analyze interfacial normal stress distributions and identify critical stress points, taking into account the substantial mismatch in the coefficients of thermal expansion between the semiconductor and encapsulation layers. The predicted temperature and stress fields are validated through finite element simulations. Furthermore, by investigating commonly used encapsulation films and solar cell modules, the coupled effects of the thermal expansion coefficient and elastic modulus are elucidated. The results demonstrate that, under a constant layer thickness, the position of the stress critical point is governed by two dimensionless parameters: the ratio of thermal expansion coefficients and the ratio of elastic moduli. This work offers an efficient and practical approach for predicting thermal stress concentration trends in laminated solar cell structures, thereby providing useful insights for the design and fabrication of solar modules.

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Publication Details

Journal
Micromachines
Published
2025-11-25
DOI
https://doi.org/10.3390/mi16121320
Primary Topic
Structural Analysis of Composite Materials
Type
article
Field-Weighted Citation Impact
0.00

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article

A Theoretical Solution for Analyzing Bi-Layer Structures with Differing Thermal Properties

Yan Shi, Qinglin Peng, Siyuan Zhou, Xiaohui Qian
Micromachines
Structural Analysis of Composite Materials
article

A Theoretical Solution for Analyzing Bi-Layer Structures with Differing Thermal Properties

Yan Shi, Qinglin Peng, Siyuan Zhou, Xiaohui Qian
article en

Abstract

Based on the Hilbert-Riemann theory, this paper develops a simplified model to address interfacial fracture in bi-layer laminated solar cells with significantly dissimilar thermal properties. The model is used to analyze interfacial normal stress distributions and identify critical stress points, taking into account the substantial mismatch in the coefficients of thermal expansion between the semiconductor and encapsulation layers. The predicted temperature and stress fields are validated through finite element simulations. Furthermore, by investigating commonly used encapsulation films and solar cell modules, the coupled effects of the thermal expansion coefficient and elastic modulus are elucidated. The results demonstrate that, under a constant layer thickness, the position of the stress critical point is governed by two dimensionless parameters: the ratio of thermal expansion coefficients and the ratio of elastic moduli. This work offers an efficient and practical approach for predicting thermal stress concentration trends in laminated solar cell structures, thereby providing useful insights for the design and fabrication of solar modules.

MicromachinesVol. 16(12)
Zhong Ke San Huan (China) (CN), Nanjing University of Aeronautics and Astronautics (CN)
Nanjing University of Aeronautics and Astronautics, Nanjing University
Openalex Percentile: Top 62%
Structural Analysis of Composite Materials
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