A High-Efficiency Environmentally Friendly Polishing Slurry for K9 Glass Utilizing Cerium-Based Compounds
Owing to the rapid advancements in optical and microsystem technologies, K9 glass is extensively utilized in the fabrication of high-precision optical components. Nevertheless, the intrinsic brittleness and elevated hardness of K9 glass, combined with the stringent demands of high-end optical systems for exceptional surface precision and minimal subsurface damage, present significant challenges for its chemical mechanical polishing (CMP) process. To overcome this challenge, we formulated a novel environmentally friendly and high-performance polishing slurry comprising cerium oxide (CeO<sub>2</sub>), aluminum oxide (Al<sub>2</sub>O<sub>3</sub>), guanidine carbonate (GC), and sodium laureth-6 carboxylate (SL-6C). The incorporation of a minor proportion of high-hardness Al<sub>2</sub>O<sub>3</sub> abrasive particles significantly enhanced the mechanical friction within the polishing slurry, thereby markedly increasing the MRR. The judicious addition of GC facilitated the formation of a hydration layer on the glass substrate. The surfactant SL-6C modulated the surface charge of the abrasive particles through electrostatic and coordination interactions, which improved particle dispersion and mitigated agglomeration. This effect minimized the risk of surface scratching and enhanced interfacial lubrication, consequently reducing the energy required for the detachment of the reaction layer. CMP findings demonstrated that utilizing an optimized slurry formulation comprising 1 wt% CeO<sub>2</sub>, 0.05 wt% Al<sub>2</sub>O<sub>3</sub>, 0.2 wt% GC, and 0.2 wt% SL-6C yielded a surface roughness of K9 glass as low as 0.11 nm. Additionally, the MRR value reached 521.71 nm/min. Compared with the polishing slurry containing only CeO<sub>2</sub>, the MRR increased by 7 times. The observed synergistic interactions among Al<sub>2</sub>O<sub>3</sub>, GC, SL-6C, and CeO<sub>2</sub> offered valuable insights for the advancement of high-performance CMP slurries.
Authors
- Kai Feng (ORCID: https://orcid.org/0000-0003-3697-6139)
- Yukun Chen (ORCID: https://orcid.org/0000-0001-5523-3942)
- Ruan Chi (ORCID: https://orcid.org/0000-0002-1046-7320)
- Zhaobo He (ORCID: https://orcid.org/0000-0003-1132-3879)
- Yue Luo (ORCID: https://orcid.org/0000-0002-1679-068X)
- Zhenmin Zou (ORCID: https://orcid.org/0000-0003-1192-6071)
- Rui Ye (ORCID: https://orcid.org/0000-0002-4021-8093)
- Shaoping Li (ORCID: https://orcid.org/0000-0003-4255-6229)
- Huidong Cui
Institutions
- China Three Gorges Corporation (China) (CN)
- China Three Gorges University (CN)
- Wuhan University of Technology (CN)
- Sinochem Group (China) (CN)
- Wuhan Institute of Technology (CN)
Publication Details
- Journal
- Molecules
- Published
- 2025-11-25
- DOI
- https://doi.org/10.3390/molecules30234546
- Primary Topic
- Advanced Surface Polishing Techniques
- Type
- article
- Field-Weighted Citation Impact
- 0.00