Comparative study on substrate quality of laser slicing and wire saw slicing for SiC wafers
Schematic diagram of apparatus and corresponding substrate quality for laser slicing and wire saw slicing technologies of SiC wafers.
Authors
- Haoyu Fan (ORCID: https://orcid.org/0009-0003-3026-1738)
- Linlin Che
- Jia‐Wei Wang (ORCID: https://orcid.org/0000-0003-1966-7131)
- Xing Zhang (ORCID: https://orcid.org/0000-0002-6634-4338)
- Qingyu Li (ORCID: https://orcid.org/0000-0003-4638-4401)
- Rongkun Wang (ORCID: https://orcid.org/0000-0003-4607-2088)
- Jianfei Zhang (ORCID: https://orcid.org/0000-0001-8006-241X)
- Boyuan Li (ORCID: https://orcid.org/0000-0002-2588-184X)
- Yufeng Xue
- Yangyang Jia (ORCID: https://orcid.org/0000-0003-3380-4016)
- Xiufang Chen (ORCID: https://orcid.org/0000-0003-0250-6999)
- Chen Qiu (ORCID: https://orcid.org/0000-0003-4294-7537)
- Yiyang Chen (ORCID: https://orcid.org/0000-0002-6589-3028)
Institutions
- Shandong University (CN)
- State Key Laboratory of Crystal Materials
Publication Details
- Journal
- CrystEngComm
- Published
- 2025-11-25
- DOI
- https://doi.org/10.1039/d5ce00994d
- Citations
- 1
- Primary Topic
- Advanced Surface Polishing Techniques
- Type
- article
- Field-Weighted Citation Impact
- 0.67