Mechanical disassembly of waste PCBs: review of methods for removing through-hole technology and surface-mount technology components

The rapid growth of electronic waste generation presents significant environmental and resource management challenges worldwide. In Indonesia, one of Asia’s largest electronic waste generators, printed circuit boards are a key target for recovery due to their content of valuable and hazardous materials. Efficient disassembly of printed circuit boards is a critical step in recycling, particularly as component mounting technologies—through-hole technology and surface-mount technology—require different handling approaches. This review examines a range of mechanical disassembly methods, focusing on their applicability to through-hole technology and surface-mount technology components, disassembly efficiency, scalability, and potential for integration into automated recycling systems. Methods are categorized into physical techniques (e.g., manual disassembly, cutting, grinding, and mandrel tools) and heating techniques (e.g., infrared heating, hot air, solder baths, laser desoldering, and heated centrifugation). Physical methods are generally more suitable for through-hole technology components due to their accessibility and mechanical robustness, while heating methods offer greater versatility and are more effective for surface-mount technology components, particularly in large-scale or automated settings. The review highlights key trade-offs between precision, environmental considerations, and industrial feasibility. By mapping disassembly strategies to component types, this paper supports the development of targeted and scalable recycling solutions, contributing to sustainable electronic waste management and circular economy goals, especially in developing countries.