Achieving high‐performance Y <sub>2/3</sub> Cu <sub>3</sub> Ti <sub>4</sub> O <sub>12</sub> thermistor ceramics with high orientation by using a sol‒gel derived strategy

Abstract High thermal stability and a wide temperature range are critical for thermistors used in extreme environments. Y 2/3 Cu 3 Ti 4 O 12 (YCTO) ceramics, known for their high room‐temperature resistance and structural stability, are promising candidates for such applications. However, inherent defects and lattice distortions limit its performance at high temperatures. Herein, to address this significant challenge, we propose a sol–gel derived strategy for inducing cubic growth of Y 2/3 Cu 3 Ti 4 O 12 ‐CB (YCTO‐CB) grains using coconut water and bone glue. The growth of {100} crystal facets has a positive effect on the inhibition of lattice deformation and dislocation, which plays a vital role in improving the oxidation resistance and suppressing the resistance attenuation. The YCTO‐CB ceramics exhibit superior thermosensitive characteristics in broad temperature range of 25°C–600°C, and have a significantly lower aging coefficient (0.27%) compared to Y 2/3 Cu 3 Ti 4 O 12 ‐B (YCTO‐B ceramics prepared by adding bone glue only) ceramics (8.1%). The study also reveals a unique “coffee‐ring” growth mechanism, where sintering‐induced dislocation repair and atomic rearrangement lead to the formation of low‐energy {100} facets. These findings highlight the potential of crystal facet engineering and bio‐additives in optimizing thermosensitive materials for high‐temperature applications, offering valuable insights for advancing thermistor technology in industrial electronics.

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Publication Details

Journal
Journal of the American Ceramic Society
Published
2025-11-23
DOI
https://doi.org/10.1111/jace.70394
Primary Topic
Electrical and Thermal Properties of Materials
Type
article
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article

Achieving high‐performance Y 2/3 Cu 3 Ti 4 O 12 thermistor ceramics with high orientation by using a sol‒gel derived strategy

Bo Zhang, Yahong Xie, Hui Deng, Yaxin Wei et al.
Journal of the American Ceramic Society
Electrical and Thermal Properties of Materials
article

Achieving high‐performance Y 2/3 Cu 3 Ti 4 O 12 thermistor ceramics with high orientation by using a sol‒gel derived strategy

Bo Zhang, Yahong Xie, Hui Deng, Yaxin Wei, Jianan Xu, Chaoyan Ma, Aimin Chang, Jia Chen, Wenyuan Li
article en

Abstract

Abstract High thermal stability and a wide temperature range are critical for thermistors used in extreme environments. Y 2/3 Cu 3 Ti 4 O 12 (YCTO) ceramics, known for their high room‐temperature resistance and structural stability, are promising candidates for such applications. However, inherent defects and lattice distortions limit its performance at high temperatures. Herein, to address this significant challenge, we propose a sol–gel derived strategy for inducing cubic growth of Y 2/3 Cu 3 Ti 4 O 12 ‐CB (YCTO‐CB) grains using coconut water and bone glue. The growth of {100} crystal facets has a positive effect on the inhibition of lattice deformation and dislocation, which plays a vital role in improving the oxidation resistance and suppressing the resistance attenuation. The YCTO‐CB ceramics exhibit superior thermosensitive characteristics in broad temperature range of 25°C–600°C, and have a significantly lower aging coefficient (0.27%) compared to Y 2/3 Cu 3 Ti 4 O 12 ‐B (YCTO‐B ceramics prepared by adding bone glue only) ceramics (8.1%). The study also reveals a unique “coffee‐ring” growth mechanism, where sintering‐induced dislocation repair and atomic rearrangement lead to the formation of low‐energy {100} facets. These findings highlight the potential of crystal facet engineering and bio‐additives in optimizing thermosensitive materials for high‐temperature applications, offering valuable insights for advancing thermistor technology in industrial electronics.

Journal of the American Ceramic SocietyVol. 109(1)
Xinjiang Technical Institute of Physics & Chemistry (CN), University of Chinese Academy of Sciences (CN), Xinjiang University (CN)
Openalex Percentile: Top 64%
Electrical and Thermal Properties of Materials
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