Review of Alumina‐Based Filler/Epoxy Resin Composites for Thermally Conductive Materials

ABSTRACT Heat dissipation has consistently been a critical issue constraining industrial development and technological advancement since the advent of industrial civilization. Given the requirements of various specific application scenarios, high‐thermal‐conductivity metals and ceramics alone cannot meet all practical needs, leading to the emergence of thermal interface materials (TIMs). These are composites consisting of polymer matrices and thermally conductive fillers. Among these materials, the variety of resins and fillers is extensive, resulting in an increasingly diverse range of TIMs. Notably, epoxy resin and alumina (Al 2 O 3 ) fillers have garnered significant attention due to their exceptional cost‐effectiveness. This article reviews recent advancements in thermally conductive materials composed of alumina and epoxy resin. Furthermore, it evaluates current research achievements in Al 2 O 3 ‐based filler/epoxy resin composites alongside the demands of industrial development while highlighting certain deficiencies in the existing research.