Silicon nitride photonic platform on glass for scalable, high-density optical redistribution layers in panel-level packaging

We present silicon nitride photonics on glass (SING), demonstrated at the wafer-level, establishing its feasibility for high-density optical redistribution layers (RDLs) in panel-level packaging. Demonstrated passive components support 106 Gbps transmission, enabling scalable wafer-level optical interconnects with grating couplers, ring resonators, MMI couplers, MZIs, and stitched waveguides. With a compact 100 µm bend radius, SING enables a 10× higher density than LDW or IOX glass platforms, while remaining compatible with large-panel processing. This positions SING as a promising and scalable solution for next-generation optical RDLs.

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Publication Details

Journal
Optics Express
Published
2025-11-10
DOI
https://doi.org/10.1364/oe.576420
Citations
1
Primary Topic
Photonic and Optical Devices
Type
article
Field-Weighted Citation Impact
0.73
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article

Silicon nitride photonic platform on glass for scalable, high-density optical redistribution layers in panel-level packaging

Jonggeon Lee, Kwang-Won Jo, B.G. Lee, Wai-Shing Choi et al.
1 citations
Optics Express
Photonic and Optical Devices
0.73
article

Silicon nitride photonic platform on glass for scalable, high-density optical redistribution layers in panel-level packaging

Jonggeon Lee, Kwang-Won Jo, B.G. Lee, Wai-Shing Choi, Joongku Lee, Taewon Jin, Younghyun Kim, Myunghwan Kim, Sanghoon Shin, S.G. Yoon, Soo-Yong Jung, Seungwoo Park, H. S. Jung, Minchul Jang
article en
1 citations

Abstract

We present silicon nitride photonics on glass (SING), demonstrated at the wafer-level, establishing its feasibility for high-density optical redistribution layers (RDLs) in panel-level packaging. Demonstrated passive components support 106 Gbps transmission, enabling scalable wafer-level optical interconnects with grating couplers, ring resonators, MMI couplers, MZIs, and stitched waveguides. With a compact 100 µm bend radius, SING enables a 10× higher density than LDW or IOX glass platforms, while remaining compatible with large-panel processing. This positions SING as a promising and scalable solution for next-generation optical RDLs.

Optics ExpressVol. 33(24)
Electronics and Telecommunications Research Institute (KR), Korea Advanced Nano Fab Center (KR)
Openalex Percentile: Top 21%
Photonic and Optical Devices
0.73
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Silicon nitride photonic platform on glass for scalable, high-density optical redistribution layers in panel-level packaging — Jonggeon Lee, Kwang-Won Jo, et al. · Optics Express (2025) | TGRS Research Map | TGRS