PFAS Free, High Reliability and Multisurface Die Attach for QFN Packages

Like many other industries, semiconductor packaging is also being impacted by increasing regulation around used of Perfluoroalkyl and Polyfluoroalkyl substance (PFAS) based materials in their supply chain. There have been increasing concerns over the years regarding hazards posed by PFAS. The regulatory bodies across the globe have taken notice and are acting on regulating the use of this chemical. On the other hand, semiconductor manufacturing has seen lot of advances in the recent years to keep pace with emerging requirements for power devices. With technology developing at rapid pace in consumer electronics and automation taking a dominant role in automotive and industrial sectors, the semiconductor devices that power these end applications need to demonstrate high performance and reliability. This high-performance requirement translates to the components and materials that are used to manufacture these devices since any weak link in the architecture of the semiconductor packages will lead to premature failure or low reliability of the device. This dual dynamics of PFAS-free regulation coupled with higher performance requirements has led to urgent demand for high performance PFAS-free material solutions.