Laser Cleaning Cylindrical Cells for Optimum Wire Bondability
Wire bonding has been used as an interconnection method in microelectronics since the 1960s and continues to migrate into new applications over time. In the last two decades, it has been utilized to interconnect cylindrical battery cells for modules for electric vehicles, airplanes, energy storage, and many other applications. It is known that cleaning the surface of the battery cells is essential for successful wire bonding. This paper will outline the influence of laser cleaning to the surface of the battery cells to achieve optimum wire bonding onto cylindrical battery cells.
Authors
- Dirk Siepe
- Tatsuya Higashi (ORCID: https://orcid.org/0000-0002-7890-6262)
- Kentaro Nakamura (ORCID: https://orcid.org/0000-0001-9115-589X)
- Dominik Haering (ORCID: https://orcid.org/0000-0002-1749-679X)
- L. Castellanos (ORCID: https://orcid.org/0009-0000-3184-8096)
- Mike McKeown
- Jack Gilson
Institutions
- Horiba (Japan) (JP)
- University of California, Irvine (US)
- Mechatronic Systemtechnik (Austria) (AT)
- Hesse (Germany) (DE)
- IMMS Institut für Mikroelektronik- und Mechatronik-Systeme gemeinnützige GmbH (IMMS GmbH) (DE)
Publication Details
- Journal
- IMAPSource Proceedings
- Published
- 2025-11-10
- DOI
- https://doi.org/10.4071/001c.147200
- Primary Topic
- Electronic Packaging and Soldering Technologies
- Type
- article
- Field-Weighted Citation Impact
- 0.00
Funders
- Ohio State University
- Santa Clara University
- San José State University
- New York Institute of Technology