Study of High Adhesion Plating Process Using Metal Oxide on Glass for Advanced Packaging

The continuous growth of cloud computing, big data analytics, and artificial intelligence has fueled the demand for high-performance and energy efficient server infrastructure. To address these needs, the semiconductor industry is actively exploring advanced packaging solutions that allow higher I/O density, improved thermal performance, and enhanced power delivery. Modern data centers are under increasing pressure to deliver greater performance within constrained thermal and power envelopes. As transistor scaling reaches its physical limits, advanced packaging technologies are becoming essential to sustain Moore’s Law. One such advancement is the use of glass core substrates in processor packaging. For server processors, research and development of glass-based interposers and substrates have been advancing to meet the demands of higher performance and integration. We have successfully developed a highly adhesive interfacial layer with a nano-anchor structure on glass substrates, where achieving strong adhesion has traditionally been difficult. This was accomplished by employing a metal oxide as an adhesion layer and precisely controlling its deposition behavior and structural characteristics. Furthermore, it was confirmed that the adhesion among the glass, metal oxide, and wiring layers can be significantly enhanced through thermal treatment. This paper introduces an innovative seed layer formation technology with high adhesion to grass core substrate, aimed at next-generation server processors.