New Thermal Management & Flexible Heater Laminate Materials for Electronics

As electronics continue to become more compact and complex, controlling heat remains a growing challenge for circuit performance and durability. DuPont is continuously innovating new Kapton® film and Pyralux® laminate materials that can better manage these challenges by increasing or reducing heat dissipation or assisting in heat generation within a system. This combination of material capabilities allows for a thin, flexible or rigid circuit that can alleviate hot spots and promote more efficient heat control within electronic systems. DuPont has introduced two innovative laminate materials to enhance thermal management in electronics. Temprion™ ODBC is a thermally conductive laminate that complements the Pyralux® laminates product family, showcasing a Kapton® film dielectric with three times the thermal conductivity of traditional Kapton® film at 0.65 W/m-K while maintaining a dielectric strength of 6 kV/mil. It also offers twice the thermal conductivity and a 12% reduction in thermal resistance compared to traditional Pyralux® AP and TFH laminates. Alternately, Pyralux® ML is a metal-clad laminate that incorporates Kapton® all-polyimide technology and various metal alloys, such as copper-nickel and Inconel®, to address unique challenges in heat generation while providing controlled heat transfer and tailored electrical resistance properties. The information highlighted here will explain the advantages of these new thermal management and heat generating laminate materials for use in electronics supported with data and end-use application examples.