SR-EMC Interface Analysis for Highly Reliable Automotive Packaging Applications

This paper introduces a new methodology for the quantitative measurement of adhesion at the interface between solder resist (SR) and epoxy molding compound (EMC) to provide more accurate and reproducible results. Additionally, this paper discusses the impact of SR filler particles on SR–EMC adhesion. Innovations in automotive semiconductors have accelerated the development of electric vehicles (EVs) and autonomous driving systems. Ensuring the reliability of automotive semiconductors under harsh conditions is essential. A critical issue identified in reliability testing is the delamination between SR and EMC, which can severely impact product durability. However, the current method of SR-EMC adhesion provides only qualitative data, and it has been highly challenging to measure it quantitatively. This paper first introduces a novel methodology for quantitatively evaluating SR-EMC adhesion, enabling comparison of different material combinations. The new test method was applied to examine the impact of fillers in SR materials and revealed that fillers significantly affect adhesion with EMC. Specifically, the choice and treatment of filler materials were found to be critical factors in resolving delamination issues. These results mark a significant step towards improving the reliability of automotive semiconductors. The results in this study are expected to contribute to improving the reliability of automotive semiconductors, driving continued innovation and growth in the automotive industry.