Jet-Dispensing Process Development for a Novel Nano-Ag-Sinterpaste for Pressureless Sintering of Miniaturized Opto-Electronic Components

This paper focuses on developing a contactless jetting technique to apply a novel microparticle-based silver (Ag) sinter paste suitable for pressureless sintering of miniaturized optoelectronic components. Traditional soldering methods encounter challenges at high temperatures, which can be addressed by employing advanced sintering techniques. In these techniques, the use of adapted materials plays a pivotal role in facilitating process adaptation. We detail the optimization of a contactless jet dispensing process and analyze the influence of key parameters, such as cartridge pressure, needle lift, rising time, and open time, on the precision and reliability of material deposition. We develop a volumetric flow model to characterize the jetting process, which enables fine control over the deposited dot volume and shape. Through experimental validation using square-footprint LED dice, we demonstrate a linear correlation between open time and dot volume while highlighting falling time as a free parameter affecting dot morphology. This methodology demonstrates the potential for the accurate and efficient application of sintering pastes in optoelectronic packaging and paves the way for future advancements in microelectronic assembly.